EE
382V – Optimization Issues in VLSI CAD
(Fall
2009 -- Course ID: 17240)
Course Material (tentative; please check frequently and finish reading assignment
before class)
- -------- Module 1:
Introduction/Preliminaries -------------------------------
- Lec 1 (8/26): General information and introduction
- Notes
set 1
- Required reading:
- ITRS executive summary, and
design challenges (download from ITRS
homepage)
- Additional references:
- IBM Journal of R&D on “Scaling
CMOS to the limits” (Vol. 46, No 2&3, 2002): a lot of good
papers from process technology to design challenges.
- Lec 2 (8/31): CMOS scaling, and timing analysis/modeling issues
for device and interconnect
- Notes
- Required reading:
- Additional reference:
- Lec 3 (9/2): More on timing/modeling issues (continued)
- Notes
- Required reading:
- Additional reference:
- Sept. 7: No class due to Labor Day
- Lec 4 (9/9): More on modeling issues and Project guide and discussion.
- ------- Module 2: Interconnect
Optimization Issues
- Lec 5 (9/14): Interconnect
topology optimization
- Lec 6 (9/16): Interconnect
topology optimization
(continued)
- Lec 7 (9/21): Transistor/gate sizing
- Notes:
- Required reading:
- Additional reading:
§
iCONTAST
paper (on static sizing using convex programming) at TCAD 1993: S. S. Sapatnekar, V. B. Rao, P. M. Vaidya,
and S. M. Kang, "An Exact Solution to
the Transistor Sizing Problem for CMOS Circuits using Convex Optimization,"
IEEE Transactions on Computer-Aided Design of Integrated Circuits and
Systems, Vol. 12, No. 11, pp. 1621 - 1634, November 1993.
- IBM EinsTuner paper on dynamic
transistor sizing: Optimization of custom MOS circuits by
transistor sizing. A.
R. Conn, P. K. Coulman, R. A. Haring, G. L. Morrill, and C.
Visweswariah. ICCAD 1996.
- Lagrangian relaxation paper by
Chen et al, 1998 (ICCAD)
- ICCAD 2000 Tutorial on Gain Based Synthesis by Kudva
et al from IBM Research (warning:
lots of slides!). You can take a
look at the logic effort based gate sizing.
- Lec 8 (9/23): Wire sizing with wire width planning
- Notes:
- Additional reference:
- Cong and Leung’s classic paper on
wire sizing: Optimal wiresizing under Elmore
delay model, TCAD, Volume:
14 , Issue: 3 , March 1995 Pages:321 – 336
- Shaping
a distributed-RC line to minimize Elmore delay, Fishburn, J.P.; Schevon,
C.A.; IEEE Transactions on
Circuits and Systems I: Fundamental Theory and Applications,
Volume: 42 , Issue: 12 , Dec. 1995 Pages:1020 – 1022 (a neat paper to read)
- Lec 9 (9/28) Buffer insertion.
- Lec 10 (9/30): Crosstalk noise modeling and reduction
- Notes: PPT (overview), and the 2-Pi
paper PPT slides.
- Required reading:
- Additional papers:
- Accurate crosstalk noise modeling for
early signal integrity analysis
Li Ding;
Blaauw, D.; Mazumder, P.; IEEE Transactions on Computer-Aided Design of
Integrated Circuits and Systems, Volume: 22 , Issue: 5
, May 2003, Pages:627 – 634
- Lec 11 (10/5): Clock synthesis
- Notes: PPT
- Required reading
- Other references:
- Lec 12 (10/7): More on clock design under process variations (link
insertion and advanced issues).
- Lec 13 (10/12): Interconnect planning
- Notes:
- Required reading:
- IPEM paper: "Interconnect
Performance Estimation Models for Design Planning" IEEE
Transactions on Computer-Aided Design of Integrated Circuits and Systems,
pp. 739--752, vol. 20, no. 6, June 2001 (J. Cong and D. Z. Pan).
- Buffer block planning paper: "Buffer
Block Planning for Interconnect Planning and Prediction", IEEE
Transactions on VLSI Systems , vol. 9, no. 6, pp.929-937, December
2001. (J. Cong, T. Kong and D. Z. Pan).
- Additional resources:
- Lec 14 (10/14): Interconnect planning (cont’d)
- First
report due
- Notes:
- Additional resources:
- SLIP (System Level Interconnect
Prediction). Please check out the web page of an international workshop
dedicated to this topic. Many slides available. http://www.sliponline.org
- 10/19: Review for midterm and project status
- 10/21: Midterm
- 10/26: Introduction to Network-on-chips
- -------
Module 3: Modern Physical Synthesis in a Nutshell
- 10/28: Placement – a key
step in nanometer design closure
- 11/2: more on placement
- ------- Module 4: Low
Power and Thermal Issues
- 11/4: Introduction on modeling, challenges,
and some key techniques
- 11/9: Low power
- 11/11: More on leakage optimization and thermal issues
- ------- Module 5: Design
for Manufacturability and Student Presentations of Selected Papers
- 11/16: DFM Introduction
- 11/18: DFM Aware Routing
- 11/23: More on DFM (double patterning, etc.). ICCAD tutorial
- 11/25: Student presentation on selected papers
- On a very recent 2009 paper – DAC,
ICCAD, ISPD, etc.
- Focusing on main problems and
ideas!!!
- 11/30: Student presentation on selected papers
- 12/2: Student presentation on selected papers and conclusions
- 12/9
(Wed) ENS127 (2-5pm): final class project presentation (each team
20 minutes)
Homework/Exam and Project